John Ternos, Apple's head of hardware engineering, confirmed that the new iPad Pros feature redesigned internal components aimed at improving their durability.
Ternos made the comments during a video interview with tech content creator Aaron Meany in response to concerns from the company's customers about the new design of the iPad Pro.
Apple recently launched the 11-inch and 13-inch iPad Pro (2024 releases) at just 5.3mm and 5.1mm thick, making them Apple's thinnest products yet.
In a related context, Greg Jozwiak, the company's global head of marketing, said that there are no compromises in the new ultra-thin design of the iPad Pro devices, thanks to the engineering design of these devices and the intelligence of Apple's silicon processors.
Ternos announced that the new iPad Pro features a new internal chassis design, and Apple has added a new metal cover to the motherboard. This change improves the durability of the device and also contributes to better heat dissipation.
Apple said in the press release that the device has 20% better cooling performance thanks to the addition of graphite chips in the main body and the use of copper in the company logo.
Users should check Apple's claims and expert reviews when offering a device for daily use to customers.
The new design again raised concerns about iPad Pro issues during the last redesign of the iPad Pro in 2018, as its durability was controversial and the company's customers commented that it folded easily. The longevity of the device, especially with its high price, which starts at $1000.