XPG, the ADATA subsidiary that makes peripherals for gamers and esports professionals, has launched an innovative coating designed to dissipate heat from DDR5 memory.
High temperatures caused by increased memory frequencies can affect system stability, performance, and reliability. That's why XPG uses innovative coating technology on the printed circuit board (PCB) of overclocked DDR5 memory to reduce temperatures by up to 10%.
ADATA XPG is expected to launch the innovative coating technology in the second quarter of this year To be available with high-performance DDR5 memories that operate at a data transfer rate of up to 8000 mega transfers per second (MT/s) or more, to ensure stable and efficient operation of this type of memory.
PCB heat dissipation technology is based on the combination of heat conduction, heat radiation and reinforced insulation (solder mask). It can not only insulate heat, but also dissipate heat to achieve better effects. cooling.
Compared with DDR5 overclocking heatsinks, the radiative and thermal effects of this coating significantly increase the heat dissipation area and slow down the memory heating process during high-frequency operation.
ADATA Labs test results confirm that DDR5 memory using PCB coating technology dissipates heat drops by approximately 8.5°C compared to DDR5 memory used with a conventional cooler without this layer.
Finally, ADATA is expected to soon release a series of DDR5 memories with innovative coating technology. XPG said it has prioritized the use of this innovative heat-conductive coating in DDR5 memory with data transfer rates of up to 8,000MB/s. The NEON RGB series and the popular LANCER RGB series are expected to be officially launched at Computex in 2024 and will be available in the second quarter of 2024.