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| Royole unveils its second release of the Flexpai 2 foldable phones |
Royole today announced the Flexpai 2 foldable phone, which uses the Snapdragon 865 processor chip to improve the foldable screen design. The segment will be officially launched in the second quarter of 2020.
Royole launched the third generation Flexpai 2 with the flexible Cicada Wing display, which includes new Flex improvements, fewer screen slits, higher brightness and contrast, and a wider viewing angle.
When launching the Flexpai 2, Liu confirmed that he launched the Snapdragon 865 processor with a 5G modem chip. The phone screen size is 7.8 inches and its size is 4: 3 when the screen is open.
Flexpai 2 also includes the LPDDR5 standard in RAM and the UFS 3.0 standard in memory, but Liu did not specifically reveal the memory and RAM specifications as the company announced more details about the phone when the phone was launched in the second quarter of 2020 ..
In today's event, Royole focused on inspecting a new flexible screen with a stunning design that can be folded up to 200,000 times without damage or damage, in addition to that the screen panel contains 100 small nano materials to improve the plate when folding. Design the screen.
Royole also said that the new Cicada Wing display supports 1.3x improvement in color gamut compared to advanced LCD monitors, 500x higher contrast, and flexible flexible support independently in different directions.
Bill Bell, Royole CEO, announced a new partnership agreement with ZTE at the event, and is expected to work with Royole in the future to provide foldable phones.
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