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| Qualcomm announces X60 5G modem chip with faster performance and 5G support for the global market |
Qualcomm today announced the X60 5G modem chip, the first 5G modem chip that combines Sub-6 and mmWave due to its small size and low power consumption.
The new X60 5G modem chip is smaller than previous versions X50 and X55, and thanks to the third generation QTM535 mmWave antenna, it also supports global connectivity to 5G networks.
The X60 5G modem chip combines Sub-6 and mmWave standards in FDD-TDD to support best modem chip performance by delivering download speeds of up to 7.5Gbps over mmWave and 5Gbps nights for Sub-6 download speed.
The ability of the X60 5G modem to connect to 5G networks worldwide will help phone manufacturers by bringing more versions of 5G devices to the global market.
The X60 5G modem chip also has a 5 nm manufacturing precision. This is a new upgrade from the X50 and X55 modem chipset introduced by Qualcomm with a 7 nm manufacturing precision. The new upgrade should provide better management and energy efficiency, and the modem needs less space.
Qualcomm plans to launch X60 5G modem chips for smart phone manufacturers this quarter. Expectations are that the first releases, including the X60 5G chips, will be launched next year.